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Amber high temperature polyimide with an ultra-durable adhesive withstands the extreme wash protocol and cleaning chemicals used in printed circuit board manufacturing.

• Withstands multiple cycles of harsh condition washes for printed circuit boards and electronic component preprocess labeling
• Resists high temperatures up to 572° F (300° C)
• Fulfills requirements for MIL-STD-202G Method 215K and SAE AS81531 Marking of Electrical Insulating Material when used with R4300 series ribbons
• Survives on the top or bottom side of printed circuit boards through the solder process